The smaller header-based connectors allow the SBC to be used within a small box or container.
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They combine powerful Intel E3800 processors with a functional I/O set including four RS-232 serial ports plus a Mini-PCle connector for easy expansion. ITX-P-3800 single board computers include dual Ethernet and four USB channels, and accommodate a wide range of DC input power: + 9V to + 36V. Equally important, it gives embedded and industrial IoT designers the flexibility to create unique designs via easy-to-use expansion and configuration settings.
The proven design of this rugged single board computer (SBC) accelerates time to market for new products while assuring that they will perform reliably in critical applications for many years – even under harsh operating conditions. Measuring a mere 3.9 inches by 2.8 inches (100 mm by 72 mm), the ITX-P-3800 delivers low-power performance, endurance and versatility. WinSystems (Arlington, TX) announced its Intel E-3800 processor-based computing platform in the Pico-ITX form factor.
Various cylinder designs with unlockable non-return check valves, hold-open devices and rod-lock units are available to meet the needs of every unique application. They feature an enclosed body that protects the internal mechanism and have been tested to be maintenance-free for 3 million operating cycles. The TCC-2Es are available in a variety of sizes.
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The new TCC-2E model, which is directly interchangeable with Destaco's 82M-3E Series Power Clamps, is especially suitable for flexible manufacturing applications in the automotive and aircraft industries.
To be more specific, Goodfellow has the capability to: fine-tune your component design or create the design for you assist in choosing the best AM process for achieving your desired results produce finished parts using AM technology or, if more appropriate, traditional manufacturing methods provide materials or finished parts in quantities from prototype to large-volume production.ĭestaco (Auburn Hills, MI) recently launched its TCC-2E Series Tolerance Compensation Clamps (TCC) that are designed to provide greater flexibility in welding and assembly applications requiring the clamping of components of differing thicknesses or tighter tolerances. In terms of manufacturing services, Goodfellow can provide comprehensive AM services, from initial drawing to post-production finishing. Raw materials currently being offered include: metal, alloy and ceramic powders metal and alloy wires and polymer monofilaments. Goodfellow (Coraopolis, PA) offers a new line of additive manufacturing (AM) materials and services that can be expertly tailored to the design, function and product life of an application. In addition, optionally available features include high-speed 4Gsps ADCs and 6.4Gsps DACs, Arm Mali™-400 GPU, 4k60 H.265/H/264 video codec, and ruggedized packages with support of -55☌ to 125☌ and 256-bit physical unclonable function (PUF).Īdditive Manufacturing (AM) Materials and Services The XQ UltraScale+ product portfolio includes the industry's first defense-grade heterogeneous multiprocessor SoC devices, combining flexible and dynamically reconfigurable high-performance programmable logic and DSP, 16Gb/s and 28Gb/s transceivers, quad-core Arm ® Cortex™-A53 embedded processors, and dual-core Arm Cortex-R5 embedded processors. The new products encompass the XQ Zynq ® UltraScale+ MPSoCs and RFSoCs, as well as XQ Ultra-Scale+ Kintex ® and Virtex ® FPGAs. (San Jose, CA) announced availability of its Defense-grade XQ UltraScale+ portfolio of products, providing the benefits of its UltraScale+ architecture plus extended temperature and ruggedized packages to address the needs of the aerospace and defense industry.
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